EXCEED-9000

Innovating semiconductor testing, JHT Design shapes tomorrow's technology

Explore our cutting-edge integrated circuit test handlers designed to exceed industry standards. Discover how our advanced machines can elevate your semiconductor testing needs and shape the future of technology. Join us in pioneering excellence with JHT Semi Conductor Company Limited.

EXCEED-9000

Pick and Place

The EXCEED-9000 series offers advanced functionalities, including a high-precision fiber optic sensor for superior accuracy and a quick change-over time of approximately 30 minutes, compatible with European machine kits. It features automatic loading and unloading for all nine trays, with a low jam rate of less than 1 per 10,000 pieces, and a mute track to reduce noise and friction.

High Precise Fiber Optic Sensor

The floating scope bigger and more accurate

Quick Change-Over

• Kit Change time Approx. 30mins

• Compatible with Europe Machine kit

Good Operator Friendly and Efficiency

• All 9 Tray Loaders & Un-Loaders are auto;

• Jam Rate < 1/ 10,000 pcs

Mute Track

• Reduce Machine noise and friction.

Testing Excellence

This series represents a pinnacle in test equipment innovation, providing unparalleled performance and versatility. Engineered with cutting-edge features, it sets a new standard for reliability and efficiency. The user-friendly design, including automatic systems and reduced maintenance needs, ensures smooth operation and enhanced productivity. Its compatibility and advanced functionalities make it an ideal choice for modern testing environments.

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KEY FEATURES

High Precise Fiber Optic Sensor

Handles components as small as 2x2 millimeters, ensuring versatility in package sizes.

Reliable Operation

Boasts a jam rate of less than 1 in 10,000, ensuring uninterrupted operation and high reliability.

Efficient Testing

Achieves an impressive throughput of 8,500 units per hour at full speed, maximizing testing efficiency.

Model Name	EXCEED-9032H	EXCEED-9032H PLUS	EXCEED-9032H SPRO
Device Type	QFP, TQFP, CSP, PLCC, QFN, BGA, LGA, PGA, TSOP
Package Size	Min.3x3mm Max. 100x100mm
Test Sites	Single site, Dual site, Quad (Square and lnline) site, Octalsite (2×4), 16 sites (2×8), 32 sites (4×8)		Single site, Dual site, Quad (Square and lnline) site, Octalsite (2×4), 16 sites (2×8)/(4×4), 32 sites (4×8)(one arm)
Test Area Opening	340 x 244 (mm)	402 x 178 (mm)	400 x 210 (mm)
Mechanical Index Time	Min.600ms (One Arm 16 sites） Min.2.2s (Two Arm 32sites)		Min.1000ms (One Arm 32 sites)
Max. Throughput	Max.12000(Ambient temp，32 sites) Max. 9000(Hot temp，32 sites)	Max.11500(Ambient temp，32 sites) Max. 8600(Hot temp，32 sites)	Max. 30000(Ambient temp，32 sites) Max. 20000(Hot temp，32 sites)
Tray Loader/Un-loader	Loader x1 Auto Tray x 3 Manual Tray x 3	Loader x1 Auto Tray x 6 Manual Tray x 3	Loader x1 Tray Seacn x 1 Auto Tray x 4 Manual Tray x 3
Temperature	+50ºC ~ +100ºC ±2ºC +100ºC ~ +130ºC ±3ºC 155 ±3ºC
Standard Tray Size	JEDEC
Power	Single Phase AC 220V 50/60HZ 32A x 2; Air flow 600L/min (0.5MPa)		Three Phase AC 380V 50/60Hz 50A x 1; Air flow 600L/min (0.5MPa)
Tester Interface	TTL/GPIB/RS232/Network
Handler Dimensions	2340(W) x 1700(D) x 2030(H) (mm)	2560(W) x 1700(D) x 2250(H) (mm)	2300(W) x 1830(D) x 2100(H) (mm)
Weight	Approx. 1600kg	Approx. 2000kg	Approx. 2100kg